Quantitative strain analysis of flip-chip electronic packages using phase-shifting moiré interferometry
| Autor: | Miller, Mikel R. *, Mohammed, Ilyas, Ho, Paul S. |
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| Zdroj: | In Optics and Lasers in Engineering 2001 36(2):127-139 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
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