Application of temporary adherence to improve the manufacturing of 3D thin silicon wafers
| Autor: | Abadie, K., Montméat, P., Enot, T., Fournel, F., Wimplinger, M. |
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| Zdroj: | In International Journal of Adhesion and Adhesives June 2019 91:123-130 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
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Full Text from ScienceDirect