Surface functionalization of micro silver flakes and their application in electrically conductive adhesives for electronic package
| Autor: | Cui, Hui-Wang, Fan, Qiong, Li, Dong-Sheng |
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| Zdroj: | In International Journal of Adhesion and Adhesives January 2014 48:177-182 |
| Databáze: | ScienceDirect |
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