Use of organosolv lignin in phenol-formaldehyde resins for particleboard production: II. Particleboard production and properties
| Autor: | Çetin, Nihat S *, Özmen, Nilgül |
|---|---|
| Zdroj: | In International Journal of Adhesion and Adhesives 2002 22(6):481-486 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
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