Curing kinetics study of thermosetting resin material with ultra-low dielectric loss for advanced electronic packaging
| Autor: | Fang, Zeming, Wu, Xiaowei, Zhu, Xiaotao, Luo, Cheng, Li, Dan, Liu, Qianfa, Wang, Ke |
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| Zdroj: | In Polymer Testing January 2024 130 |
| Databáze: | ScienceDirect |
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Full Text from ScienceDirect