The curing kinetics and mechanical properties of epoxy resin composites reinforced by PEEK microparticles
Autor: | Zheng, Ting a, Xi, Hang b, Wang, Zixuan a, Zhang, Xiaohong a, ∗, Wang, Yuan a, Qiao, Yingjie a, Wang, Peng a, c, Li, Qiuwu a, Li, Zhuona a, Ji, Cheng a, Wang, Xiaodong a, ∗∗ |
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Zdroj: | In Polymer Testing November 2020 91 |
Databáze: | ScienceDirect |
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