Evolution of surface topography in dependence on the grain orientation during surface thermal fatigue of polycrystalline copper
Autor: | Aicheler, M., Sgobba, S., Arnau-Izquierdo, G., Taborelli, M., Calatroni, S., Neupert, H., Wuensch, W. |
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Zdroj: | In International Journal of Fatigue 2011 33(3):396-402 |
Databáze: | ScienceDirect |
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