Evolution of surface topography in dependence on the grain orientation during surface thermal fatigue of polycrystalline copper

Autor: Aicheler, M., Sgobba, S., Arnau-Izquierdo, G., Taborelli, M., Calatroni, S., Neupert, H., Wuensch, W.
Zdroj: In International Journal of Fatigue 2011 33(3):396-402
Databáze: ScienceDirect