Investigation of thermal effects in copper chemical mechanical polishing
| Autor: | Liu, Pengzhan, Bae, Sunghoon, Hong, Seokjun, Bae, Chulwoo, Seo, Hyeonmin, Lee, Jungryul, Tang, Cheng, Kim, Taesung |
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| Zdroj: | In Precision Engineering January 2022 73:195-202 |
| Databáze: | ScienceDirect |
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