Precipitation processes and phase interface structure of Ag3Sn during solidification of SnAg3Cu0.5/Cu solder joint
| Autor: | Chen, Dongdong, Zhang, Xin, Yang, Jiaojiao, Qin, Junhu, Yi, Jianhong, Yan, Jikang, Li, Caiju, Xu, Fengxian, Leng, Congyan |
|---|---|
| Zdroj: | In Vacuum January 2024 219 Part A |
| Databáze: | ScienceDirect |
| Externí odkaz: |
|
Full Text from ScienceDirect