Wetting behavior and mechanical properties of Sn-10Sb solder/Ni-plated Cu system with different surface structures
| Autor: | Wang, Rongyue, Yuan, Zhangfu, Ma, Bowen, Mei, Lu, Zhao, Hongxin, Xu, Bingsheng |
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| Zdroj: | In Vacuum November 2023 217 |
| Databáze: | ScienceDirect |
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