Geometrical outline evolution and size-inhibiting interaction of interfacial solder bubbles and IMCs during multiple reflows
| Autor: | Ma, Haoran, Wang, Yunpeng, Chen, Jun, Kunwar, Anil, Ma, Haitao, Zhao, Ning |
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| Zdroj: | In Vacuum November 2017 145:103-111 |
| Databáze: | ScienceDirect |
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Full Text from ScienceDirect