The electromigration study of thin-film structured Sn3.5Ag and Ag using continuous observation and reliability enhancement approach
| Autor: | Jin, Zhi, Huo, Fupeng, Han, Duy Le, Liu, Xunda, Tatsumi, Hiroaki, Chan, Y.C., Nishikawa, Hiroshi |
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| Zdroj: | In Thin Solid Films 1 June 2023 774 |
| Databáze: | ScienceDirect |
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