Adhesion mechanism between mold resin and sputtered copper for electromagnetic wave shield packages
| Autor: | Homma, Soichi, Shima, Masaya, Takano, Yuusuke, Watanabe, Takeshi, Murakami, Kazuhiro, Fukuda, Masatoshi, Imoto, Takashi, Nishikawa, Hiroshi |
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| Zdroj: | In Thin Solid Films 31 May 2022 750 |
| Databáze: | ScienceDirect |
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Full Text from ScienceDirect