Mechanism of indium tin oxide//indium tin oxide direct wafer bonding
| Autor: | Hönle, Michael, Oberhumer, Peter, Hingerl, Kurt, Wagner, Thorsten, Huppmann, Sophia, Katz, Simeon |
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| Zdroj: | In Thin Solid Films 30 June 2020 704 |
| Databáze: | ScienceDirect |
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Full Text from ScienceDirect