Simulation and growing study of Cu–Al–S thin films deposited by atomic layer deposition
| Autor: | Duclaux, L., Donsanti, F., Vidal, J., Bouttemy, M., Schneider, N., Naghavi, N. |
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| Zdroj: | In Thin Solid Films 2 November 2015 594 Part B:232-237 |
| Databáze: | ScienceDirect |
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Full Text from ScienceDirect