Diffusion barrier property of MnSixOy layer formed by chemical vapor deposition for Cu advanced interconnect application
| Autor: | Nguyen, Mai Phuong, Sutou, Yuji, Koike, Junichi |
|---|---|
| Zdroj: | In Thin Solid Films 1 April 2015 580:56-60 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
|
Full Text from ScienceDirect