Copper deposition in microporous silicon using supercritical fluid
| Autor: | Jin, Lianhua, Oya, Toshifumi, Tamekuni, Shigeaki, Watanabe, Mitsuhiro, Kondoh, Eiichi, Gelloz, Bernard |
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| Zdroj: | In Thin Solid Films 30 September 2014 567:82-86 |
| Databáze: | ScienceDirect |
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Full Text from ScienceDirect