Mechanisms of copper direct bonding observed by in-situ and quantitative transmission electron microscopy
| Autor: | Martinez, M., Legros, M., Signamarcheix, T., Bally, L., Verrun, S., Di Cioccio, L., Deguet, C. |
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| Zdroj: | In Thin Solid Films 1 March 2013 530:96-99 |
| Databáze: | ScienceDirect |
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