Investigation of optical properties of benzocyclobutene wafer bonding layer used for 3D interconnects via infrared spectroscopic ellipsometry

Autor: Kamineni, Vimal K., Singh, Pratibha, Kong, LayWai, Hudnall, John, Qureshi, Jamal, Taylor, Chris, Rudack, Andy, Arkalgud, Sitaram, Diebold, Alain C.
Zdroj: In Thin Solid Films 28 February 2011 519(9):2924-2928
Databáze: ScienceDirect