Influence of incorporated non-metallic impurities on electromigration in copper damascene interconnect lines
| Autor: | Stangl, M., Lipták, M., Acker, J., Hoffmann, V., Baunack, S., Wetzig, K. |
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| Zdroj: | In Thin Solid Films 2009 517(8):2687-2690 |
| Databáze: | ScienceDirect |
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