Modeling the diffusion of solid copper into liquid solder alloys
| Autor: | Rizvi, M.J., Lu, H., Bailey, C. |
|---|---|
| Zdroj: | In Thin Solid Films 2009 517(5):1686-1689 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
|
| Autor: | Rizvi, M.J., Lu, H., Bailey, C. |
|---|---|
| Zdroj: | In Thin Solid Films 2009 517(5):1686-1689 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
|
Full Text from ScienceDirect