High aspect ratio via etch development for Cu nails in 3-D-stacked ICs
| Autor: | Van Aelst, J., Struyf, H., Boullart, W., Vanhaelemeersch, S. |
|---|---|
| Zdroj: | In Thin Solid Films 2008 516(11):3502-3506 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
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| Autor: | Van Aelst, J., Struyf, H., Boullart, W., Vanhaelemeersch, S. |
|---|---|
| Zdroj: | In Thin Solid Films 2008 516(11):3502-3506 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
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Full Text from ScienceDirect