Effect of Ti seed layer on Co/Cu metallic multilayers: Changing Ti seed layer thickness
| Autor: | Chihaya, H., Kamiko, M., Yamamoto, R. |
|---|---|
| Zdroj: | In Thin Solid Films 5 December 2006 515(4):2542-2548 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
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| Autor: | Chihaya, H., Kamiko, M., Yamamoto, R. |
|---|---|
| Zdroj: | In Thin Solid Films 5 December 2006 515(4):2542-2548 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
|
Full Text from ScienceDirect