The effect of annealing on the morphologies and conductivities of sub-micrometer sized nickel particles used for electrically conductive adhesive
| Autor: | Goh, C.F., Yu, H., Yong, S.S., Mhaisalkar, S.G., Boey, F.Y.C., Teo, P.S. |
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| Zdroj: | In Thin Solid Films 2006 504(1):416-420 |
| Databáze: | ScienceDirect |
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