Process design of Cu(Sn) alloy deposition for highly reliable ultra large-scale integration interconnects
| Autor: | Kim, Hoon, Koseki, Toshihiko, Ohba, Takayuki, Ohta, Tomohiro, Kojima, Yasuhiko, Sato, Hiroshi, Shimogaki, Yukihiro |
|---|---|
| Zdroj: | In Thin Solid Films 2005 491(1):221-227 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
|
Full Text from ScienceDirect