Modeling of curing and post-curing kinetics for a thermoset adhesive

Autor:	Zhang, Xiumin, Zhao, Yuxi, Xia, Huanxiong, Ao, Xiaohui, Liu, Jianhua, Zhou, Jiechen, Wang, Yuhe
Zdroj:	In Thermochimica Acta June 2024 736
Databáze:	ScienceDirect
Externí odkaz:	Zobrazit plný text záznamu Full Text from ScienceDirect