Novel silicone–phenyl contained amine curing agent for epoxy resin: 1. Non-isothermal cure and thermal decomposition
| Autor: | Cao, Jun, Hu, Jijiang, Fan, Hong, Wan, Jintao, Li, Bogeng |
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| Zdroj: | In Thermochimica Acta 10 October 2014 593:30-36 |
| Databáze: | ScienceDirect |
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