Strain effects on n-InGaAs heterostructure-on-insulator made by direct wafer bonding
| Autor: | Rossel, C., Weigele, P., Czornomaz, L., Daix, N., Caimi, D., Sousa, M., Fompeyrine, J. |
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| Zdroj: | In Solid State Electronics August 2014 98:88-92 |
| Databáze: | ScienceDirect |
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