Electrical characterization of copper interconnects with end-of-roadmap feature sizes

Autor:	Schindler, G, Steinlesberger, G, Engelhardt, M, Steinhögl, W
Zdroj:	In Solid State Electronics 2003 47(7):1233-1236
Databáze:	ScienceDirect
Externí odkaz:	Zobrazit plný text záznamu Full Text from ScienceDirect