A novel PEG/PMMA based binder composition for void-free metal injection moulding of Ti components
| Autor: | Hayat, Muhammad Dilawer, Zhang, Hongzhou, Karumbaiah, Kariappa Maletira, Singh, Harshpreet, Xu, Ying, Zou, Liming, Qu, Xuanhui, Ray, Sudip, Cao, Peng |
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| Zdroj: | In Powder Technology April 2021 382:431-440 |
| Databáze: | ScienceDirect |
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