Impact of material anisotropy on ultrafast laser dicing of SiC wafers for enhancing efficiency and quality
| Autor: | Gao, Rui a, Wang, Chunjin a, ⁎, Zhang, Qixian a, Xiong, Lingda b, Zhang, Qingzheng c, Jiang, Chen c |
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| Zdroj: | In Optics and Laser Technology May 2025 183 |
| Databáze: | ScienceDirect |
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