Oriented design of wafer-level stacking structures to enhance reliability of laser debonding of thin devices
| Autor: | Wang, Fangcheng, Liu, Qiang, Li, Jinhui, Huang, Mingqi, Dai, Wenxue, Wang, Xuefan, Zhang, Guoping, Sun, Rong |
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| Zdroj: | In Optics and Laser Technology February 2024 169 |
| Databáze: | ScienceDirect |
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