Thermal management of power electronics modules packaged by a stacked-plate technique
| Autor: | Haque, Shatil *, Stinnett, William A., Nelson, Douglas J., Lu, Guo-Quan |
|---|---|
| Zdroj: | In Microelectronics Reliability 1999 39(9):1343-1349 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
|
Full Text from ScienceDirect