Modelling thermomechanical degradation of moulded electronic packages using physics-based digital twin
| Autor: | Inamdar, A., van Soestbergen, M., Mavinkurve, A., van Driel, W.D., Zhang, G.Q. |
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| Zdroj: | In Microelectronics Reliability June 2024 157 |
| Databáze: | ScienceDirect |
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