Study on the effect of anti-oxidation film formed by composite system on solder balls performance
| Autor: | Wang, Tongju, Lin, Zipeng, Zhang, Wenqian, Lei, Yongping, Zhao, Jiangtao |
|---|---|
| Zdroj: | In Microelectronics Reliability April 2024 155 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
|
Full Text from ScienceDirect