Testing and simulation of lifetime for wire bond interconnections with varying bond foot angle
| Autor: | Sippel, Marcel, Tan, Yi Fong, Schmidt, Ralf, Botazzoli, Pietro, Sprenger, Mario, Franke, Jörg |
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| Zdroj: | In Microelectronics Reliability April 2024 155 |
| Databáze: | ScienceDirect |
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Full Text from ScienceDirect