Brazing failure of inner power modules' interconnects using scattering parameter characterization
Autor: | Gopishetti, A., Baffreau, S., Vidal, P.-E., Duchesne, C., Long, T.L. |
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Zdroj: | In Microelectronics Reliability November 2023 150 |
Databáze: | ScienceDirect |
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