Ruggedized sensor packaging with advanced die attach and encapsulation material for harsh environment
| Autor: | Tay, Y.S., Yang, L., Zhang, H., Kor, H.B., Zhang, L., Liu, H., Gill, V., Lambourne, A., Li, K.H.H., Chen, Z., Gan, C.L. |
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| Zdroj: | In Microelectronics Reliability November 2023 150 |
| Databáze: | ScienceDirect |
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Full Text from ScienceDirect