Underfill material property dependence of lifetime and mechanical behavior of BGA package: EBSD and FEM investigations
| Autor: | Kim, Dajung, Park, Jiyeon, Jang, Jeongki, Yang, Hyunseung, Kim, Kwangho, Oh, Chulmin, Kim, Dongjin |
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| Zdroj: | In Microelectronics Reliability November 2023 150 |
| Databáze: | ScienceDirect |
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