Mechanical stress in a tapered channel hole of 3D NAND flash memory

Autor:	Yoon, DongGwan, Sim, JaeMin, Song, YunHeub
Zdroj:	In Microelectronics Reliability April 2023 143
Databáze:	ScienceDirect
Externí odkaz:	Zobrazit plný text záznamu Full Text from ScienceDirect