Co-deposition of C and Ni[sbnd]P to fabricate high-ohmic resistor for board-level integration with on-line monitoring method
Autor: | Zhou, Guoyun, Luo, Yuxing, Hong, Yan, He, Wei, Wang, Shouxu, Chen, Yuanming, Wang, Chong, Tang, Yao, Sun, Yukai, Zhu, Yongkang, Li, Jiujuan |
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Zdroj: | In Microelectronics Reliability March 2023 142 |
Databáze: | ScienceDirect |
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