Finite element modeling and analysis of ultrasonic bonding process of thick aluminum wires for power electronic packaging
| Autor: | Tang, Jiuyang, Li, Liangtao, Zhang, Guoqi, Zhang, Jing, Liu, Pan |
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| Zdroj: | In Microelectronics Reliability December 2022 139 |
| Databáze: | ScienceDirect |
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