Thermal fatigue analysis of gold wire bonding solder joints in MEMS pressure sensors by thermal cycling tests
| Autor: | Zhang, Yunfan, Wu, Kangkang, Li, Hui, Shen, Shengnan, Cao, Wan, Li, Feng, Han, Jinzhe |
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| Zdroj: | In Microelectronics Reliability December 2022 139 |
| Databáze: | ScienceDirect |
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