Interdiffusion and formation of intermetallic compounds in high-temperature power electronics substrate joints fabricated by transient liquid phase bonding
| Autor: | Imediegwu, Chidinma, Graham, Samuel, Pahinkar, Darshan G., Narumanchi, Sreekant, Paret, Paul, Major, Joshua |
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| Zdroj: | In Microelectronics Reliability October 2022 137 |
| Databáze: | ScienceDirect |
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