Multi-domain system level modeling approach for assessment of degradation behaviour under thermal and thermo-mechanical stress
| Autor: | Dobs, T., Elsotohy, M., Jaeschke, J., Sehr, F., Strogies, J., Wilke, K. |
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| Zdroj: | In Microelectronics Reliability November 2022 138 |
| Databáze: | ScienceDirect |
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