Effect of electroless Cu depositions for micro-via structure and thermal cycling reliability
| Autor: | Zhang, Zheng, Hsieh, Ming-Chun, Liu, Ran, Yeom, Jeyun, Suetake, Aiji, Yoshida, Hiroshi, Chen, Chuantong, Kang, Joonhaeng, Honma, Hidekazu, Kitahara, Yuhei, Matsunami, Takashi, Otsuka, Kuniaki, Suganuma, Katsuaki |
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| Zdroj: | In Microelectronics Reliability November 2022 138 |
| Databáze: | ScienceDirect |
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