Verification of creep properties and rupture lifetime evaluation methods using small diameter Sn-3.0Ag-0.5Cu/Sn-58Bi/Sn-5Sb specimens
Autor: | Hiyoshi, Noritake |
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Zdroj: | In Microelectronics Reliability September 2022 136 |
Databáze: | ScienceDirect |
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