A cost-effective repair scheme for clustered TSV defects in 3D ICs
| Autor: | Maity, Dilip Kumar, Roy, Surajit Kumar, Giri, Chandan |
|---|---|
| Zdroj: | In Microelectronics Reliability February 2022 129 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
|
| Autor: | Maity, Dilip Kumar, Roy, Surajit Kumar, Giri, Chandan |
|---|---|
| Zdroj: | In Microelectronics Reliability February 2022 129 |
| Databáze: | ScienceDirect |
| Externí odkaz: |
|
Full Text from ScienceDirect