Correction factors to strength of thin silicon die in three- and four-point bending tests due to nonlinear effects

Autor:	Tsai, M.Y., Huang, P.S.
Zdroj:	In Microelectronics Reliability January 2022 128
Databáze:	ScienceDirect
Externí odkaz:	Zobrazit plný text záznamu Full Text from ScienceDirect