Constructal design for the layout of multi-chip module based on thermal-flow-stress coupling calculation
| Autor: | Nan, Gang, Xie, Zhihui, Guan, Xiaonan, Ji, Xiangkun, Lin, Daoguang |
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| Zdroj: | In Microelectronics Reliability December 2021 127 |
| Databáze: | ScienceDirect |
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Full Text from ScienceDirect